- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- CT 6310W
[PDF] - Epoxy
- White
- 32.000
- Fast cure, Toughened, High bonding Strength (metal), Low Dk/Df
- Electronic component protection, FPC coating, Magnet bonding, Structural bonding, Reinforcement (Reflow cure)
- CT 6309W
[PDF] - Epoxy
- White
- 24.000
- Fast cure, Toughened, High bonding Strength (metal/PET/PA/LCP/SPS)
- Connector reinforcement, Structural bonding (Reflow cure)
- EW 6318H
[PDF] - Epoxy
- Black
- 3.500
- Low viscosity, Narrow gap filling
- Connector sealant
- EW 6325H
[PDF] - Modified Epoxy
- Black
- 170.000
- Fast cure, Toughened, High bonding strength (PA/LCP/PCB/Metal), Resistance to moisture/weathering/thermal shock and mechanical stress
- Component bonding, Reinforcement (Reflow/Wave solder cure)
- EW 6326
[PDF] - Epoxy
- Black
- 23.000
- Low temperture cure, High bonding strength (SS/Magnets)
- Bonding
- EW 6328
[PDF] - Epoxy
- Black
- 36.000
- Low temperture cure, High bonding strength (SS/Magnets)
- Bonding
- EW 6336
[PDF] - Epoxy
- Blue
- 32.000
- UV + Thermal cure, High bonding strength (FPC/SS/PC/PCB), Protection against mechanical/environmental stress
- Mechanical/Environmental protection on FPC/PCB
- EW 6339
[PDF] - Epoxy
- Transparent
- 500
- UV + Thermal cure, Low shrinkage, Optically transparent, Good flowability, Low Viscosity
- Optical component bonding/potting
- EW 6341LV
[PDF] - Modified Epoxy
- Transparent
- 12.000
- UV + Thermal cure, Low shrinkage, Good impact resistance
- Camera component bonding/sealing
- EW 6625B
[PDF] - Modified Epoxy
- Black
- 170.000
- Fast cure, Toughened, High bonding strength (PA/LCP), Resistance to moisture/weathering/thermal shock and mechanical stress
- Electronic component bonding, Protection of polymer substrates, Reinforcement (Reflow cure)
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- EW 6610
[PDF] - Epoxy
- Part A: Transparent
Part B: Yellow - Part A: 3.500
Part B: 2.000
Mixed: 3.000 - Low viscosity/hardness, Resistance to moisture/weathering and mechanical stress, Good flexibilty/flowability
- Potting/protection of electronic components
- EW 6615
[PDF] - Epoxy
- Part A: Black
Part B: Light Yellow - Part A: 1.600
Part B: 7.500
Mixed: 18.000 - Low CTE/shrinkage, Thixotropic, Resistance to moisture/weathering and mechanical stress
- Bonding/potting of electronic components
- EW 6616
[PDF] - Epoxy
- Part A: Black
Part B: Grey - Part A: 10.750
Part B: 9.700
Mixed: 10.000 - Soft, Flexible, Resistance to moisture/weathering and mechanical stress
- Potting of electronic components (sensors/other devices) requiring extreme thermal shock conditions
- EW 6619
[PDF] - Epoxy
- Part A: Transparent
Part B: Transparent - Part A: 73.000
Part B: 3.500
Mixed: 11.000 - Fast cure at RT, Electrical/environmental resistance, High transparency
- Potting/protection of electronic components
- EW 6627
[PDF] - Epoxy
- Part A: Milky
Part B: Milky - Part A: Paste
Part B: Paste - Good toughness, Thixotropic, Electrical/environmental resistance
- Bonding of electronic components; Reinforcement (PCB/Power Supply/LED)
- EW 6628
[PDF] - Epoxy
- Part A: Grey
Part B: Grey - Part A: 370.000
Part B: 125.000
Mixed: 260.000 - Fast cure at elevated temperature, Good Thermal Conductivity, High bonding strength (ABS/PC/PCB/SS), Electrical/environmental resistance
- Bonding of electronic component; Thermally conductive potting
- EW 6440
[PDF] - Modified Epoxy
- Part A: Black
Part B: Light Yellow - Part A: 18.000
Part B: 7.000
Mixed: 13.000 - Fast cure, Resistance to moisture/weathering/thermal shock and mechanical stress; High bonding strength (PA/Al/SS)
- Structural bonding
- EW 6645
[PDF] - Modified Epoxy
- Part A: Black
Part B: Brown - Part A: 7.000
Part B: 7.200
Mixed: 15.000 - Fast cure, Resistance to mechanical and thermal shock, High bonding strength (PVC)
- Bonding/potting of plastic components
- EW 6650
[PDF] - Epoxy
- Part A: Milky
Part B: Transparent - Part A: 20.000
Part B: 16.000
Mixed: 25.000 - Fast cure, Thixtropic, Electrical and environmental resistance
- Potting of switching components
- EW 6657
[PDF] - Epoxy
- Part A: Transparent
Part B: Transparent - Part A: 11.000
Part B: 200
Mixed: 1.500 - Fast cure at elevated temperture, Good flowability, High hardness
- Potting for optical components
- EW 6680
[PDF] - Epoxy
- Part A: Transparent
Part B: Transparent - Part A: 11.000
Part B: 13.000
Mixed: 13.000 - Fast cure, Good flowability, Environmental resistance
- Potting for electronic components/chargers; Structural bonding
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- N-Coat 9560
[PDF] - Modified Alkyd Resin
- Slightly Yellow
- 75
- Low viscosity, Flexible, Good flowability, High bond stregth (FPC/PCB), Excellent electrical properties, Environmental resistance, Fluoresces under UV light
- Protection/insulation of assembled circuit boards
- N-PU 5103
[PDF] - Modified Polyurethane
- Transparent
- 250
- UV + Moisture dual cure for shadowed areas, Low odor, Flexible, High bond strength (FPC/PCB), Excellent electical properties, Environmental resistance, Fluoresces under UV light
- Protection/insulation of assembled circuit boards
- N-PU 5103H
[PDF] - Modified Polyurethane
- Transparent
- 600
- UV + Moisture dual cure for shadowed areas, Low odor, Flexible, High bond strength (FPC/PCB), Excellent electical properties, Environmental resistance, Fluoresces under UV light
- Protection/insulation of assembled circuit boards
- N-PU 5103M
[PDF] - Modified Polyurethane
- Transparent
- 120
- UV + Moisture dual cure for shadowed areas, Low odor, Flexible, High bond strength (FPC/PCB), Excellent electical properties, Environmental resistance, Fluoresces under UV light
- Protection/insulation of assembled circuit boards
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- EW 6064
[PDF] - Epoxy
- Black
- 400
- Fast cure, Good flowability, Reworkable, Halogen-free
- Underfill for BGA/CSP
- EW 6066
[PDF] - Epoxy
- Black
- 500
- Fast cure, Good flowability, Reworkable, Halogen-free, High Tg
- Underfill for BGA/CSP
- EW 6068
[PDF] - Epoxy
- Black
- 2.800
- Fast cure, Halogen-free, High Tg
- Underfill for BGA/CSP
- EW 6360
[PDF] - Epoxy
- Black
- 6.500
- Good flowability, Halogen-free, High Tg, Low CTE, Compatible with lead-free solder paste, Excellent reliability
- Underfill for BGA/CSP
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- CT 7255
[PDF] - Ethyl Cyanoacrylate
- Transparent
- 2.500
- Low odor/whitening, Minimal blooming, Flexible, Good bonding strength (rubber/metal/plastic), Good impact/heat/humidity resistance
- Bonding
- CT 7281
[PDF] - Ethyl Cyanoacrylate
- Transparent
- 100
- Fast fixture, Good bonding strength for difficult-to-bond substrates (wood/leather/fabric)
- Bonding (porous materials)
- CT 7283
[PDF] - Ethyl Cyanoacrylate
- Transparent
- 30
- Fast fixture, Good bonding strength to difficult-to-bond substrates (rubber/metal/plastic/elastomer/leather)
- Bonding
- CT 7286
[PDF] - Ethyl Cyanoacrylate
- Transparent
- 2.500
- Low odor/whitening, Minimal blooming, Good bonding strength (metal/plastic)
- Bonding
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- N-PU 5605
[PDF] - Polyurethane
- White/Yellow
- 4.000-6.000
- Reworkable, High bonding strength (PC/ABS/Metal/Glass)
- Structural bonding for mobile devices
- N-PU 5606
[PDF] - Polyurethane
- White/Yellow
- 4.000-6.000
- Quick position, High initial bonding strength, High bonding strength (PC/ABS/Metal/Glass)
- Structural bonding for mobile devices
- N-PU 5608
[PDF] - Polyurethane
- White/Yellow
- 3.000-5.000
- High bonding strength (PC/ABS/Metal/Glass)
- Structural bonding for mobile devices
- N-PU 5610
[PDF] - Polyurethane
- White/Yellow
- 4.000-6.000
- High bonding strength (PC/ABS/Metal/Glass)
- Structural bonding for mobile devices
- N-PU 5618BL
[PDF] - Polyurethane
- Black
- 3.000-5.000
- Jet-dispensable, High bonding strength (PC/ABS/Metal/Glass)
- Structural bonding for mobile devices
- N-PU 5626
[PDF] - Polyurethane
- White/Yellow
- 4.000-8.000
- Quick position, High initial bonding strength, High bonding strength (PC/ABS/Metal/Glass)
- Structural bonding for industrial/wooden furniture structures and PU foams
- N-PU 5628
[PDF] - Polyurethane
- White/Yellow
- 10.000-16.000
- Quick position, High initial bonding strength, High bonding strength (PC/ABS/Metal/Glass)
- Structural bonding for industrial/wooden furniture structures and home appliances
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- N-PU 5105
[PDF] - Modified Polyurethane
- White/Black
- Paste
- Fast cure, Soft, Flexible, Resistance to moisture/various solvents, Excellent electrical properties after water immersion
- Flexible sealing/protection of components on PCB; FPC reinforcement
- N-PU 5107
[PDF] - Modified Polyurethane
- White/Black
- Paste
- Quick fixation, Soft, Flexible, Resistance to moisture/various solvents, Excellent electrical properties after water immersion
- Sealing/protection of components on PCB; Reinforcement of FPC; Bonding, Gap filling
- N-Sil 8101W
[PDF] - Silicone
- White
- 1.500
- Fast cure, Soft, Flexible, Resistance to moisture/various solvents, Excellent electrical properties, Resistance to high temperature
- Sealing/potting for FPC
- N-Sil 8113
[PDF] - Silicone
- Transculent
- Paste
- Fast cure, Soft, Flexible, Excellent electrical properties after water immersion, Resistance to moisture/high temperature/various solvents
- Sealing/protection of electronic components on PCB, Sealing of speaker enclosures, FPC reinforcement
- N-Sil 8136
[PDF] - Silicone
- White/Black
- Paste
- Quick fixation, Resistance to high temperature
- Sealing/protection of electronic components on PCB, PCB bonding, FPC reinforcement
- N-Sil 8533
[PDF] - Silicone
- White/Black
- Paste
- Fast cure, Soft, Flexible, Resistance to moisture/high temperature/various solvents, Excellent electrical properties after water immersion
- Sealing/bonding of components on PCB; FPC reinforcement
- N-Sil 8551
[PDF] - Modified Silicone
- Black
- Paste
- Fast cure, Tin-free, High initial bond strength, Excellent impact/vibration resistance
- Sealing/bonding of electronic components
- N-Sil 8552
[PDF] - Modified Silicone
- Black
- 16.000
- Fast cure, Low viscosity, Tin-free, High initial bond strength, Excellent impact/vibration resistance
- Sealing/bonding of electronic components
- N-Sil 8556
[PDF] - Modified Silicone
- Black
- 14.000
- Fast cure, Low viscosity, Tin-free, Medium bond strength, Excellent impact/vibration resistance
- Sealing/bonding of electronic components
- N-Sil 8580
[PDF] - Silicone
- White/Black
- Paste
- Fast cure, Soft, Flexible, UL-94_V0, Excellent electrical properties, Resistance to high temperature/moisture/various solvents
- Sealing/protection of electronic components on PCB; FPC reinforcement
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- N-Sil 8206
[PDF] - Silicone
- Part A: White
Part B: Grey - Part A: 3.500
Part B: 3.500
Mixed: 3.500 - Low shrinkage/mechanical stress, High reliability, Excellent shock resistance, UL94_V0
- LED power supply encapsulation/potting
- N-Sil 8215
[PDF] - Silicone
- Part A: White
Part B: Grey - Part A: 10.000
Part B: 10.000
Mixed: 10.000 - Low shrinkage/mechanical stress, High reliability, Excellent shock resistance, UL94_V0
- High-power component potting, LED power supply encapsulation
- N-Sil 8220
[PDF] - Silicone
- Part A: White
Part B: Grey - Part A: 15.000
Part B: 15.000
Mixed: 15.000 - High thermal conductivity, Low shrinkage/mechanical stress, High reliability, Excellent shock resistance, UL94_V0
- Electrical power and High-power component potting, LED power supply encapsulation
- N-Sil 8275
[PDF] - Silicone
- Part A: Red
Part B: Red - Part A: 4.500
Part B: 7.000
Mixed: 6.000 - Excellent heat resistance/shock resistance, High bonding strength (metal/ceramic); Low shrinkage/mechanical stress; High reliability
- Auto power potting, PTC heater
- N-Sil 8701
[PDF] - Silicone
- Part A: Transparent
Part B: Transparent - Part A: 900 - 1.200
Part B: 500 - 700
Mixed: 700 - 1.000 - High transparency/reliability, Good flowability, Low shrinkage/component stress, Excellent shock resistance
- IGBT flexible potting
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- AW 2901
[PDF] - Modified Acrylate
- Part A: Orange
Part B: Pink - Part A: 4.500
Part B: 4.500
Mixed: 4.500 - Low odor, Low viscosity, Heat resistance, Good bonding strength (metal/ceramic/plastic/wood)
- Structural bonding
- AW 2902
[PDF] - Modified Acrylate
- Part A: Pale Yellow
Part B: Blue - Part A: 15.000
Part B: 15.000 - Low odor, Excellent temperture/impact resistance/heat resistance, Good bonding strength (nickel-plated galvanized materials)
- Structural bonding
- AW 2903
[PDF] - Modified Acrylate
- Part A: Brown
Part B: Green - Part A: 9.000
Part B: 9.000 - Fast cure, Low odor, Excellent water and heat resistance/impact resistance, Good bonding strength (steel/SS/aluminum/ceramic/FRP/Metals treated with high temperature baking finish)
- Structural bonding
- AW 2916
[PDF] - Modified Acrylate
- Part A: White
Part B: Pale Green - Part A: 15.000
Part B: 15.000 - Low odor, High viscosity, Excellent heat resistance, Good bonding strength (metal/ceramic/plastic/wood)
- Structural bonding
- AW 2919
[PDF] - Modified Acrylate
- Part A: Milky-White
Part B: White - Part A: 608.000
Part B: 30.000 - Low odor, Non-sagging, Excellent impact resistance/toughness, Good bonding strength (metal/ceramic/plastic)
- Frame Structural bonding, Automotive components, Thermoformed enclosures, Metal fabrication/assembly, Plastic fabrication, Computer assembly
- AW 2922M
[PDF] - Modified Acrylate
- Part A: Milky-White
Part B: White - Part A: 40.000
Part B: 42.000 - Low odor, Non-sagging, Excellent toughness/impact resistance, Good bonding strength (metal/ceramic/plastic)
- Frame Structural bonding, Automotive components, Thermoformed enclosures, Metal fabrication/assembly, Plastic fabrication, Computer assembly
- AW 2925U
[PDF] - Modified Acrylate
- Part A: Blue
Part B: Pale Yellow - Part A: 800.000
Part B: 1.000.000 - Fast cure, Excellent thermal conductivity/heat resistance, Good bonding strength (metal/ceramic/plastic)
- Thermally conductive structural bonding
- AW 2928
[PDF] - Modified Acrylate
- Part A: Pale Yellow
Part B: Blue - Part A: 8.000
Part B: 13.000 - Non-sagging, Excellent toughness/impact resistance, Good bonding strength (metal/ceramic/plastic)
- Frame Structural bonding, Automotive components, Thermoformed enclosures, Metal fabrication/assembly, Plastic fabrication, Computer assembly
- AW 2943
[PDF] - Modified Acrylate
- Part A: Orange
Part B: Blue - Part A: 6.000
Part B: 6.000 - Fast cure, Low odor, Excellent water/heat/moisture resistance; Long working temperature, Good bonding strength (plastic/ferrite/galvanized/nickel/chromium plated metals)
- Structural bonding
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- N-Sil 8608
[PDF] - Silicone
- White
- Paste
- Low viscosity, Good gap filling performance, Moderate thermal conductivity, High temperture resistance, Removable
- Power devices, LEDs
- N-Sil 8615
[PDF] - Silicone
- Grey
- Paste
- Minimal bleeding, Low modulus/mechanical stress, High thermal conductivity/temperature resistance, Good thermal cycling reliability, Reworkable
- Power devices, LEDs
- N-Sil 8620
[PDF] - Silicone
- Grey
- Paste
- Minimal bleeding, Low modulus/mechanical stress, High thermal conductivity/temperature resistance, Good thermal cycling reliability, Reworkable
- High-power LEDs, Thermalelectric devices
- N-Sil 8630
[PDF] - Silicone
- Grey
- Paste
- Minimal bleeding, Low modulus/mechanical stress, High thermal conductivity/temperature resistance, Good thermal cycling reliability, Reworkable
- CPU/GPU, Heat sinks
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- CW 3705
[PDF] - Epoxy
- Silver
- 3.600
- Low viscosity, Low temperture cure, High Electrical conductivity, Flexible, Tack free
- Electrically conductive gap filing/sealing
- EW 6345CA
[PDF] - Epoxy
- Black
- 350.000
- Low CTE/shrinkage, High Thermal conductivity/temperature resistance
- Thermal conductive bonding for ICs
- EW 6345HDL
[PDF] - Epoxy
- Black
- 50.000
- Low CTE/shrinkage, High thermal conductivity/temperature resistance, Low Thermal cure
- Thermal conductive bonding for ICs
- EW 6345HS
[PDF] - Epoxy
- Black
- Paste
- High viscosity, Low CTE/shrinkage, High temperature resistance/thermal conductivity, Reworkable
- Thermal conductive bonding for ICs
- EW 6361
[PDF] - Epoxy
- Silver
- 14.500-16.500
- No stringiness/tailing, Low modulus, Hard but flexible, Lead-free reflow resistance
- Electrically conductive die attach bonding
- N-Sil 8735
[PDF] - Silicone
- Pink
- Paste
- One-part gel, Low modulus/mechanical stress/thermal impedance, High thermal conductivity/reliability, Good resistance to thermal cycling, Removable
- Power mudule, Computer
- N-Sil 8742
[PDF] - Silicone
- Part A: Pink
Part B: White - Part A: 350.000
Part B: 250.000
Mixed: 300.000 - Two-part gel, Contours easily to complex shapes, High thermal conducvity, Wet surface, Easy to dispense/apply, Removable
- Power mudule, Computer
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- CT 2288
[PDF] - Acrylate
- Transcluent
- 9.000-13.000
- Thixotropic, Low shrinkage/stress, Flexible, Soft, Resistance to moisture/heat/weathering/thermal shock
- Sealing, Bonding, Potting, Solder joint protection
- PW 1008
[PDF] - Acrylate
- Transparent
- 250
- UV/Visible light cure option, Fluorescent under UVA light, High bonding strength (ABS/PC/PETG/PMMA),
- Medical grade: Sealing, Bonding, Potting
- PW 1081
[PDF] - Acrylate
- Transparent
- 3.000
- UV/Visible light option, Soft/flexible/transparent once cured, , Fluorescent under UVA light, High bond strength (ABS/PC/PETG/PMMA)
- Medical grade: Sealing, Bonding, Potting
- PW 1422
[PDF] - Modified Acrylate
- Black
- 1.000
- Flexible, Water proof (IPX7), Mechanical shock resistance, High bonding strength (SS/Glass)
- Sealing (screws), Bonding (battery cell), Potting (plastics/metals)
- PW 1435
[PDF] - Modified Acrylate
- Transparent
- 5.600
- Resistance to humidity/water immersion, High bonding strength (glass/Al)
- Sealing/Bonding/Potting of glass/Al
- PW 1436
[PDF] - Modified Acrylate
- Black
- 6.000
- Flexible, Soft, Resistance to heat/humidity
- Solder joint protection
- PW 1442
[PDF] - Modified Acrylate
- Milky
- 14.000
- Flexible, Resistance to mechanical shock, High bonding strength (PC/PMMA/ABS/SS)
- Sealing/Potting of metals/plastics, Bonding (battery cell)
- PW 1446M
[PDF] - Modified Acrylate
- Transparent/Blue
- 36.000
- Elastic, Fexible, Waterproof (IPX7), High bonding strength (PC/glass/Al)
- Sealing/FIPG/Edge sealing, Bonding
- PW 1448
[PDF] - Modified Acrylate
- Blue
- 17.500
- Reworkable
- Temporary surface protection
- PW 1450
[PDF] - Acrylate
- White
- 5.000
- Low shrinkage/stress, High Thermal Conductivity, Resistance to moisture/weathering/thermal shock and cycling loads, High bond strength (PCB/Al)
- Sealing/Bonding/Potting/ requiring thermal conductivity.
- PW 1451
[PDF] - Modified Acrylate
- Transparent
- 1.000
- Resistance to humidity/water immersion, High bond strength (PC/ABS/PMMA)
- Sealing (glass-glass), Bonding
- PW 1460
[PDF] - Modified Acrylate
- Transparent/Transcluent
- 12.000
- Medium hardness, Flexible, Secondary moisture cure for shadowed areas
- Sealing/Bonding/Protection of PCBs and other electronic components
- PW 1475
[PDF] - Modified Acrylate
- Light Yellow/Transparent
- 1.600
- Resistance to humidity/water immersion, High bond strength (PC/PVC/PMMA/glass), Sealing (PVC)
- Sealing, General bonding
- PW 1482M
[PDF] - Modified Acrylate
- Transparent
- 2.000
- Resistance to humidity/water immersion, High bonding strength (PC/Al/glass)
- Sealing, Bonding, Potting (glass-glass)
- PW 1485N
[PDF] - Modified Acrylate
- Transcluent
- 6.200
- Low UV energy cure, Resistance to humidity/water immersion, High bonding strength
- Bonding (camera lens)
- PW 1504
[PDF] - Modified Acrylate
- Transparent
- 1.000
- Resistance to humidity/water immersion, High bonding strength (PC/Al/MMA)
- Sealing, Bonding, Potting
- PW 1516HV
[PDF] - Modified Acrylate
- Transparent/Transcluent
- 16.500
- Low UV energy/temperature cure, Resistance to moisture/temperature/mechanical shock, High bonding strength (PC/PMMA)
- Camera module/Lens bonding, IR filter
- PW 1516NF
[PDF] - Modified Acrylate
- Transparent/Transcluent
- 16.500
- Low UV/Heat cure, Resistance to moisture/temperature/mechanical shock, High bonding strength (PC/PMMA)
- Camera module/Lens bonding, IR filter
- Name
- Chemical Type
- Appearance
- Viscosity @
25°C[mPa•s]
110°C[mPa•s] - Features
- Applications
- PW 2401
[PDF] - Modified Acrylate
- Black
- 18.000
- Low hardness, High Tg/toughness, Excellent temperature and humidity performance, Sweat-resistant
- Camera module/Sensor bonding